領先的分析技術

勝科納米擁有多位半導體領域里知名專家，他們均擁有平均10多年海內外業界經歷，具備20年以上的失效分析和可靠性分析測試創業/服務經驗。通過將國際一流的分析技術專家團隊與半導體一線產品專家相結合，勝科納米搭建了矩陣式海內外技術團隊結構，持續不斷地研發出新分析測試技術和表征方法，使公司始終保持在行業內的技術領先優勢。

目前勝科納米國際專家級分析測試團隊已獲得授權專利21項（還有20余項專利在申請中），累計在國際頂級會議與雜志上發表論文60余篇，軟件著作權登記4件，并參與編寫2本書籍，擁有自主研發的全球首創的材料分析、失效分析和可靠性分析技術近百余項。

此外，公司擁有自主研發、獨創的實驗室生產管理系統。進行對公司各部門重點指標權責化管理，達到公司運營效率的最優化和實現三化（自動化、IT化和信息化），以此提高公司績效和客戶服務質量。

世界領先的制樣及分析技術介紹

2022年5月20日勝科納米喜獲中國國家專利局的授權：封裝器件水汽入侵路徑檢測方法及裝置 （The method and appliance to study the moisture penetration in molded devices），專利號為： CN114216954 B ZL 2022 1 0164278.7。與此同時，我們的研發團隊在國際核心期刊發表了一篇關于該創新技術的論文：Lois Liao Jinzhi, Tian Meng, Du Yong, Ji Qiang, Zhu Lei, Zhang Xi, Hua Younan and Li Xiaomin. Application of deuterium oxide (D₂O) isotope tracing technique for encapsulated QFN failure analysis. Microelectronics Reliability，Volume 135, 114607, August 2022.廖金枝，田夢，杜勇，紀強，朱雷，張兮，華佑南和李曉旻，氧化氘（D2O）同位素示蹤技術在封裝QFN失效分析中的應用，微電子可靠性，第 135 卷，114607，2022 年 8 月。

用于封裝的塑封料（多為環氧樹脂）通常是非氣密性的。塑封料會吸收大氣中的水分，這會對封裝的可靠性造成風險。在這項應用研究中，一種塑封料封裝器件 QFN 在高加速應力測試 (HAST) 96 小時后發生漏電。盡管懷疑是濕氣入侵到QFN導致漏電失效，但沒有直接證據證明這個假設。而傳統的方法，如X-射線和掃描聲學顯微鏡(C-SAM) 技術由于其檢測靈敏度有限，無法檢測到器件的任何缺陷。為了解決上述問題，勝科納米研發團隊采用了新技術氧化氘（D₂O）同位素示蹤方法，即重水示蹤法。該方法首先對QFN 樣品進行重水水汽引入， 然后使用飛行時間二次離子質譜（TOF-SIMS）探測樣品內重水的信號。結果表明，氘富集在漏電故障區域。該結果直接證明了QFN器件的漏電是由濕氣造成的。

1、關于重水示蹤法

在半導體器件、顯示屏 、芯片使用過程中, 環境中存在的水汽會入侵到樣品內部, 而造成很多失效問題, 例如腐蝕、短路和氣泡等等。如何進行動態監控水汽入侵的路徑和速率，把標準的濕熱可靠性實驗的結果與水汽侵入結果聯系起來，從而得知水汽入侵的途徑和入侵的速率和吸水率，以及其對半導體器件可靠性帶來的影響，對于了解產品可靠性失效機制、監控產品壽命和約束產品下電紅線非常重要。

勝科納米經過兩年的研究開發了重水示蹤法來研究水汽入侵狀態。重水是由氫的重同位素氘和氧組成的化合物 ，也稱為氧化氘，分子式為D₂O。本研究把示蹤法應用到半導體器件和顯示屏等領域追蹤水汽在樣品里面的擴散入侵路徑。待測樣品會放置在重水設備里面引入重水水汽，然后使用飛行時間二次離子質譜(Time-of-Flight Secondary Ion Mass Spectrometry, TOF-SIMS) 分析技術對樣品指定的位置進行深度分析，探測重水存在的信號和入侵路徑。重水實驗結果可以指導觸屏研發人員改善產品水汽入侵的薄弱環節，而提供產品的質量和可靠性。

2、納米熒光探針

（1）技術參數：

可靠性測試。折疊/彎曲

探測尺寸：10納米/100納米

多重熒光探針選項

靈敏度。<0.1%

（2）應用：

折疊取裂縫定位

TFE/鈍化/密封裂縫

玻璃裂縫

失效分析

納米熒光定位：OLED彎折區微裂紋、邊框微裂紋、TFE微裂紋、玻璃微裂紋

納米熒光滲透納米級微裂紋，多波段熒光結合排除干擾定位

勝科納米（Wintech-Nano）

發表的論文（Publications）

從2014年-2021年

Summary

From 2014-2021, the company published total of 64 technical papers, 2 books and 1 trade mark.

2014 （10 Papers）

1.    Hua Younan, Xing Zhen Xiang and Li Xiaomin, Characterization Studies of Fluorine-induced Corrosion Crystal Defects on Microchip Al Bondpads Using X-ray Photoelectron Spectroscopy. The Proceedings of the 21st International Physics and Failure Analysis (IPFA2014), 30 June-4 July, Singapore, ID 88, p94-97 (2014).

2.    Shen Yiqiang, Chen Yixin, Lee Hwangsheng, Chow Shueyin, Xing Zhenxiang, Hua Younan, Li Xiaomin,  XPS and TEM Studies of Oxidation States on Sn Solder Ball. The Proceedings of the 21st International Physics and Failure Analysis (IPFA2014), 30 June-4 July, Singapore , ID 93, p127-130 (2014).

3.    Chen Yixin, Hao Meng, Shao Jingjing, Lee Esther, Xin Qiuju, Song Lu, Li Kai, Lee Hwang Sheng, Shen Yiqiang,  Xing  Zhen Xiang, Khoo Bing Sheng, Chooi Meailing, Kon Cambridge,  Zhou Yongkai, Feng Yang, Fu Chao, Hua Younan and Li Xiaomin，ATR-FTIR, DUEL BEAM SEM FIB and TOF-SIMS Studies on High Temperature and Moisture Induced “White Haze” Following the Pattern of Electrodes in Touch Panels. The Proceedings of the 21st International Physics and Failure Analysis (IPFA2014), 30 June-4 July, Singapore , ID 98, p135-138 (2014).

4.    Yongkai Zhou, Younan Hua and Xiaomin Li，Spectrum Sharpening on Rotation Averaged TEM Nano Beam Electron Diffraction Patterns. The Proceedings of the 40th International Symposium for Testing and Failure Analysis (ISTFA 2014), November 9-13, 2014, Houston, Texas, USA, p152-155 (2014).

5.   Chen Yixin, Emmanuel Simon, Bing Sheng Khoo, Esther Lee，Meailing Chooi，Hao Meng, Shao Jing Jing, Hua Younan and Li Xiaomin， A comprehensive investigation of the galvanic corrosion induced Ag-Al bonding degradation in microelectronic packaging using Ar ion milling, SEM, Dual Beam FIB-SEM, STEM and TOF-SIMS. The Proceedings of the 40th  International Symposium for Testing and Failure Analysis (ISTFA 2014), November 9-13, 2014, Houston, Texas, USA, p166-171 (2014).

6.    Hua Younan, Chen Yixin, Zhou Yongkai, Fu Chao and Li Xiaomin， Failure Mechanism Studies and Root Cause Identification of Non-Stick on Pad on Microchip Al Bondpads. The Proceedings of the 40th International Symposium for Testing and Failure Analysis (ISTFA 2014), November 9-13, 2014, Houston, Texas, USA, p219-221 (2014).

7.    Shao Jingjing, Hua Younan, Shen Yiqiang, Lee Hwangshen, Zhou Yongkai, Xing Zhen Xiang, Hao Meng and Li Xiaomin, Al-Cu Alloy Films Characterization & Studies using TOF-SIMS, XPS, AFM, EBSD & TEM. The Proceedings of the 40th International Symposium for Testing and Failure Analysis (ISTFA 2014), November 9-13, 2014, Houston, Texas, USA, p505-510 (2014).

8.    Hua Younan, Chen Yixin, Shao Jingjing, Hao Meng, Shen Yue, Xing Zhenxiang，Feng Yang, Fu Chao and Li Xiaomin，Characterization Studies of Non-Stick On Pad (NSOP) Using AES, XPS and TOF-SIMS, 36th International Electronics Manufacturing Technology Conference (IEMT 2014) Renaissance Johor Bahru Hotel, Johor, Malaysia, November 11-13, 2014

9.    Hua Younan, Shao Jingjing, Haomeng, An Wenwen, Xing Zhenxiang, Chen Yixin, Fu Chao and Li Xiaomin, TOF-SIMS Technique and Its Applications in Failure analysis and Material Analysis. The Proceedings of the SIMS China V Conference, October 18-21, 2014, Beijing, China, p75-83 (2014).

10.   Shen Yiqiang, Hua Younan, Liu Yifei, Chen Yixin, Fu Chao and Li Xiaomin, Studies & Applications of the Standard Samples in Dynamic-SIMS Analysis. The Proceedings of the SIMS China V Conference, October 18-21, 2014, Beijing, China, p87-92 (2014).

2015 （3 Papers）

11.   Hua Younan, Chen Yixin, Fu Chao and Li Xiaomin，Failure Mechanism Studies and Elimination of Galvanic Corrosion (Al-Cu Cell）on Microchip Aluminum Bondpads in Copper Process. The Proceedings of the 41st International Symposium for Testing and Failure Analysis (ISTFA 2015), November 1-5, 2015, Portland, Ore. USA (2015).

12.   Hua Younan, Shen Yue, Chen Yixin, Fu Chao and Li Xiaomin，Studies on a Qualification Method (OSSD) for Microchip Al Bondpads. The Proceedings of the 41st International Symposium for Testing and Failure Analysis (ISTFA 2015), November 1-5, 2015, Portland, Ore. USA (2015).

13.   Yongkai Zhou, Shik Lin Lee, Chao Fu, Younan Hua and Xiaomin Li, Fault Isolation and TEM Study in State-Of-Art Thin-Film Transistors. The Proceedings of the 41st International Symposium for Testing and Failure Analysis (ISTFA 2015), November 1-5, 2015, Portland, Ore. USA (2015).

2016（8 Papers）

14.   Hua Younan, Hua Younan, Khoo Bingsheng, Henry Leong, Chen Yixin, Chan Eason, Wang Jingyuan and Li Xiaomin. Studies on a Novel Qualification Method of Silicon Nitride Layer The Proceedings of the 42nd International Symposium for Testing and Failure Analysis (ISTFA 2016), November 6-10, 2016, Fort Worth Convention Centre, Fort Worth, TX, USA (2016).

15.   Hua Younan, Studies and Application of Auger Monitoring System for Quality Control and Assurance of Al Bondpads. The Proceedings of the 42nd International Symposium for Testing and Failure Analysis (ISTFA 2016), November 6-10, 2016, Fort Worth Convention Centre, Fort Worth, TX, USA (2016).

16.   Hua Younan, Shen Yue，Niu Zilu, Chen Yixin and Li Xiaomin, Studies and Applications of SIMS (D-SIMS and TOF-SIMS) in Contamination Analysis. The proceedings of the 6th National SIMS Symposium, 08-12 October, Dalian, China, p21-23 (2016).

17.   Hua Younan, Shen Yue，Niu Zilu, Wu Junxian, Erika Therese S. Abella, Khoo Bingchao, Chen Yixin and Li Xiaomin, Applications of TOF-SIMS and XPS in Failure Analysis and Material Characterization. The proceedings of the 6th National SIMS Symposium, 08-12 October, Dalian, China, p36-38 (2016). 

18.   Hua Younan, Fuchao, Shen Yue, Shan Yuqin, Chen Yixin and Li Xiaomin, Studies and Applications of SEM/EDX, XPS and AES in Failure Analysis and Material Characterization. The proceedings of the CTEX and PCB Conference, 18-20 May, Suzhou, China (2016).

19.   Hua Younan, Shen Yue, Li Kai, Wang Jing Yuan, Chan Yong Shen, Chen Yixin，Fu Chao and Li Xiaomin. Studies on XPS Valence State Analysis of Copper Materials. The proceedings of the 37th International Electronics Manufacturing Technology (IEMT) - 18th Electronics Materials & Packaging (EMAP) Conference, 20-22 September 2016, G-Hotel, Penang, Malaysia，B2.3 (2016).

20.   Hua Younan, Shen Yue, Shan Yuqin,, Chen Yixin，Fu Chao and Li Xiaomin. Application of XPS and TOF-SIMS in Failure Analysis and Characterization of Aluminum Fluoride Defects on Microchip Al Bondpads. The proceedings of the National Surface Analysis Symposium, 10-12 Aug, 2016, Kunming, China (2016).

21.  Yixin Chen, Younan Hua, Bing Sheng Khoo, Henry Leong, Vanie Bagulbagul, Yansong Wang, Yanlin Pan, Eason Chan, Maohua Chen, Jing Yuan Wang, Yue Shen, Zilu Niu, Jun Xian Goh, Erika Therese S. Abella and Xiaomin Li Comprehensive Physical and Chemical Characterization of the Galvanic Corrosion Induced Failures. The Proceedings of the 23rd International Physics and Failure Analysis (IPFA2016), July 2016, Singapore, 191 (10B.4), (2016).

2017 （7 Papers）

22.   Hua Younan, Karen Toh, Shen Yue, Khoo Bingsheng and Li Xiaomin. Studies of TEM/EDX Data Process and Application in Identification of Cu Oxide Compounds, The Proceedings of the 24th International Physics and Failure Analysis (IPFA2017), July 2017, Chengdu, China (2017).

23.   Hua Younan. Studies of Al Bondpad Qualification Methodologies and Application in Backend Process Optimization and Improvement in Wafer Fabrication. The Proceedings of the 24th International Physics and Failure Analysis (IPFA2017), July 2017, Chengdu, China (2017).

24.   Hua Younan, Shen Yue, Shan Yuqin,, Fu Chao and Li Xiaomin. Application of XPS and TOF-SIMS in Failure Analysis and Characterization of Aluminum Fluoride Defects on Microchip Al Bondpads and Studies of Failure Mechanism. The proceedings of the 2017 National Conference on Surface Science and Technology, 11-13 Aug, 2017, Shantou University, Shantou, China (2017).

25.   Hua Younan. Auger/SEM/EDX Analysis and Failure Mechanism Study of Aluminum Bromide Defects in Wafer Fabrication. The proceedings of the 2017 National Conference on Surface Science and Technology, 11-13 Aug, 2017, Shantou University, Shantou, China (2017).

26.   Hua Younan, Shen Yue, Khoo Bingsheng and Li Xiaomin, Studies of Surface Analysis Techniques and Applications in Material Characterization and Failure Analysis, PSECE 2017 - 14th Philippine Semiconductor and Electronics Convention and Exhibition (PSECE) - Paper 23-1600, 21-23 June 2017, SMX Convention Center, Manila, Philippines (2017).

27.   Hua Younan. NSOP Problem and Failure Mechanism Studies. PSECE 2017 - 14th Philippine Semiconductor and Electronics Convention and Exhibition (PSECE) - Paper 23-1600, 21-23 June 2017, SMX Convention Center, Manila, Philippines (2017).

28.   Hua Younan. Studies of Fluorine-induced Corrosion and Defects on Microchip Al Bondpads and Auger Monitoring for Quality Control and Assurance. SSEA17, SEMICON Southeast Asia, Penang, Malaysia (2017).

2018 （11 Papers）

29.   Wang Bisheng, Lois Liao Jinzhi and Li Xiaomin. Characterization of interfacial intermetallic compounds in gold wire bonding with copper pad.  IEEE 20th Electronics Packaging Technology Conference, Singapore, p1-5 (2018).

30.   Hua Younan, Can We Use EDX To Determine Fluorine Contamination Level on A Normal Al Bondpad? The Proceedings of the 25th International Physics and Failure Analysis (IPFA2018), July 2018, Singapore (2018).

31.   Che Yan, Niu Zilu, Hua Younan and Li Xiaomin, A TOF-SIMS investigation of the corrosion-induced failure via grain boundaries in polycrystalline materials. The Proceedings of the 25th International Physics and Failure Analysis (IPFA2018), July 2018, Singapore (2018).

32.   Hua Younan, Wu Mengxue, Niu Zilu, Liu Jiahui, Erika Therese S. Abella,Khin Yin Pang,Shenyue and Li Xiaomin, Studies of Secondary Ion Mass Spectrometry (D-SIMS and TOF-SIMS) and Its Applications in Failure Analysis of Semiconductor, Wafer Fabrication and Packaging, the 7th China SIMS Conference, 08-12, Oct 2018, Suzhou(2018).

33.   Hua Younan, Shenyue, Niu Zilu, Goh Junxian, Erika Therese S. Abella, Khin Yin Pang and Li Xiaomin,X-ray Photoelectron Spectroscopy(XPS) and Time-of-flight Secondary Ion Mass Spectrometry (TOF-SIMS) combined application for quantitative analysis of Phosphorus and Boron, the 7th China SIMS Conference, 08-12, Oct 2018, Suzhou(2018).

34.   Hua Younan, Liang Qichao, Shenyue, Sun Jie and Li Xiaomin, Studies of AES and Application in Monitoring Fluorine Contamination and Quality Control of Al Bondoads of Wafer Fabrication. The Proceedings of the 2018 NMSSA 2018, 12-15, Oct 2018, Suzhou,  China (2018).

35.   Hua Younan, Niu Zilu, Erika Therese S. Abella, Khin Yin Pang,Zhang Nan and Li Xiaomin, Time of Flight Secondary Ion Mass Spectrometry (TOF-SIMS) and Its Application in Biological Sample Analysis and Research. The proceedings of the 2018 NMSSA 2018, 12-15, Oct 2018, Suzhou,  China (2018).

36.   Hua Younan, Shenyue, Goh Junxian, Kee Yehyee and Li Xiaomin, Qualification of Microchip Al Bondpad and Elimination of NSOP, The Proceedings of IEMT Conference 2018, 04-06 Sept 2018,  Malaysia.

37.  Lois Liao Jinzhi; Chen Yan; Wang Bisheng; Li Xiaomin; Fu Chao; Hua Younan, A Review on the Copper Bond Pad Application in Wire Bond Technique,, The 19th International Conference on Electronic Packaging Technology (ICEPT), 2018 IEEE , 08-11 Aug, Shanghai, China (2018).

38.   Binghai Liu, Younan Hua, Zhili Dong, Pik Kee Tan,Yuzhe Zhao, Zhiqiang Mo,Jeffrey Lam, Zhihong Mai, The Overview of the Impacts of Electron Radiation on Semiconductor Failure Analysis by SEM, FIB and TEM, The Proceedings of the 25th International Physics and Failure Analysis (IPFA2018), July 2018, Singapore (2018).

39.   Binghai Liu, Zhi Li Dong, Younan Hua, Chao Fu, Xiaomin Li, Pik Kee Tan, and Yuzhe Zhao Electron-beam radiation induced degradation of silicon nitride and its impact to semiconductor failure analysis by TEM, AIP Advances vol. 8, 115327 (2018).

2019 （9 Papers）

40.   Lois Liao Jinzhi, Song Jianbo, Zhu Lei, Chen Yan, Cho Nan, Yao Qinghong, Fu Chao, Hua Younan and Li Xiaomin, A study on an abnormal oxidation issue of copper bonding wire. The Proceedings of the 26th International Physics and Failure Analysis (IPFA2019) = No. 115; July 2019, Hangzhou, China (2019).

41.   Wang Bisheng, Lois Liao Jinzhi, Zhang Xi, Li Xiaomin, Hua Younan, Tee Weikok, Yee Boonhwa and Mao Songlin, Comparison of Cl effect on Au-Al and Cu-Al HTS and bHAST wire bond reliability performance. The Proceedings of the 26th International Physics and Failure Analysis (IPFA2019) = No. 156; July 2019, Hangzhou, China (2019).

42.   Hua Younan. How To Determine Fluorine Contamination Level On A Normal Al Bondpad? The Proceedings of the 26th International Physics and Failure Analysis (IPFA2019) = No. 199; July 2019, Hangzhou, China (2019).

43.   Mengxue Wu, Lei Zhu, Jiahui Liu, Younan Hua and Xiaomin Li, Study of cross contamination between InP substrate and Silicon substrate during Phosphors depth profile measurement. The Proceedings of the 26th International Physics and Failure Analysis (IPFA2019) = No. 243; July 2019, Hangzhou, China (2019).

44.   Tan HK, Liu BH, Hua YN and Li XM, Study of Silicon thickness for electron transparency transparency, The Proceedings of the 26th International Physics and Failure Analysis (IPFA2019) = No. 310; July 2019, Hangzhou, China (2019).

45.   Hua Younan, Studies of Advanced Failure Analysis Techniques and Applications in Advanced Packaging Devices and Product & System Level Test Processing. SSEA2019, SEMICON Southeast Asia, Kuala Lumpur, Malaysia (2019).

46.   Lois Liao Jinzhi, Zhang Xi, Wang Bisheng, Li Xiaomin, Hua Younan, Fu Chao, Tee Weikok, Yee Boonhwa and Mao Songlin, Comprehensive study of wire bond reliability impacts from wire, molding compound and bond pad contaminations. The Proceedings of the ICICDT conference; 17-19 June 2019, Suzhou, China (2019).

47.   Hua Younan, Studies of characterization and analysis methodologies of Al bondpads and applications in wafer fabrication and assembly processes. The proceedings of the NMSSA 2019, 11-14 August 2019, Chengdou, China, p33 (2019).

48.   Hua Younan, Xu Ke，Kee Yehyee，Zhu Lei and Li Xiaomin，Studies and Applications of AFM in material chacterization and failure analysis. The proceedings of the NMSSA 2019, 11-14 August 2019, Chengdou,  China, p52 (2019).

2020 （5 Papers）

49.   Liao Jinzhi Lois1, Yu Minglang, Tee Weikok, Wang Bisheng, Jia Wenping, Yee Boonhwa, Zheng Haipeng, Zhang Xi, Fu Chao, Hua Younan and Li Xiaomin, COMPREHENSIVE COMPARISON OF THE WIRE BOND RELIABILITY PERFORMANCE OF CU, PDCU AND AG WIRES, CSTIC2020 Shanghai, China 18-20 March (2020).

50.   Din-Ghee Neoh, Tee Weikok, Liao Jinzhi Lois, Jia Wenping, Yee Boonhwa, Boon-Seong LEE, Wang Bisheng, Zhang Xi, Hua Younan and Li Xiaomin, ENHANCING HIGH TEMPERATURE ADHESION PERFORMANCE VIA A RENOVATED LEADFRAME SURFACE TREATMENT, CSTIC2020, Shanghai, China 18-20 March (2020).

51.   Liao Jinzhi Lois, Tee Weikok, Yu Minglang, Wang Bisheng, Zhang Xi, Yee Boonhwa, Hua Younan and Li Xiaomin, bHAST, PCT, TCT reliability performance comparison of Cu-Al, PdCu-Al, Ag-Al, EPTC (2020), Singapore (2020).

52.   Lei Zhu, Caryn Sek, Jun Xian Goh, Yeh Yee Kee, Jing Fang Pan, Yanfei Zhao, Younan Hua, Xiaomin Li，Defect and Contamination Analysis Necessity with Multiple Surface Analytical Techniques, The Proceedings of the 27th International Physics and Failure Analysis (IEEE IPFA2020), Singapore, No. 42（2020）.

53.   Z. Luo, Ling Lu, H. Xie, Y. Xu, X. Chen, A. Talapatra, A. O. Adeyeye, Younan Hua, Xiaomin Li and Y. Wu, Platinum composition dependence of spin-orbit torque in (Fe0.8Mn0.2)1-xPtx single-layer ferromagnet. Appl. Phys. Lett. 117, 172402 (2020).

2021 （12 Papers）

54.   Hua Younan, Liu Binghai, Zhu Lei, Lois Liao and Li Xiaomin,Failure Analysis & Mechanism Studies of the Worm-like Defects in Vias of Wafer Fabrication, EPTC 2021, No-103, Singapore (2021).

55.   Hua Younan, Kee Yehyee, Zhu Lei , Liao Lois, Liu Binghai and Li Xiaomin, Failure Analysis and Elimination of the Bromine-induced Defects in Wafer Fabrication, EPTC 2021, No-104, Singapore (2021).

56.   Lois Jinzhi Liao, Liu Binhai, Xi Zhang, Younan Hua, Xiaomin Li,Atmospheric corrosion of Ag/Cu plated FeNi based leadframe used in MOSFET package, The Proceedings of the 28th International Physics and Failure Analysis (IEEE IPFA2021), Singapore (2021).

57.   Lei Zhu, Derrick Tan, Caryn Sek, Binghai Liu, Younan Hua and Li Xiaomin,Sample Preparation For VCSEL Device Contamination Analysis, The Proceedings of the 28th International Physics and Failure Analysis (IEEE IPFA2021), Singapore (2021).

58.   Sek  Kei  Lin, Lee Pei Lin, Pang Khin Yin, Hua Younan,  Zhu Lei  and  Li  Xiaomin,  Principal

Component Analysis (PCA) of Surface Contamination by TOF-SIMS, The Proceedings of the 28th International Physics and Failure Analysis (IEEE IPFA2021), Singapore (2021).

59.   Yeh Yee Kee, Kei Lin Sek, Lei Zhu, Younan Hua, Xiaomin Li,A Novel CMOS Image Sensor Package Cover Glass White Stain Material Identification Metrology by TOF-SIMS, The Proceedings of the 28th International Physics and Failure Analysis (IEEE IPFA2021), Singapore (2021).

60.   Hua Younan, Zhu Lei， Zhao Yinfei , and Li Xiaomin, Studies on pre-processing methods of semiconductor samples and application in analysis of   phosphorus contamination in wafer fabrication using  secondary ion mass spectrometry. The 8th Chinese National conference on SIMS (SIMS-China VIII), Zhuhai, China (2021)

61.   Hua Younan, Application of Time-of-Flight Secondary Ion Mass Spectrometry in Failure Analysis of Ammonia Ions Contamination on Aluminum Pads of Semiconductor Wafers. The 8th Chinese National conference on SIMS (SIMS-China VIII), Zhuhai, China (2021)

62.   Zhu Lei , Hua Younan, Derrick Tan , Liu Binghai, Zhao Yinfei and Li Xiaomin. VCSEL device contamination secondary ion mass spectrometry analysis and sample preparation method. The 8th Chinese National conference on SIMS (SIMS-China VIII), Zhuhai, China (2021)

63.   Ling Lu, H. Xie, Z. Luo, N. Muthu, X. Chen, Xiaomin Li, Younan Hua and Y. Wu, Frequency selectivity of spin Hall magnetoresistance sensor and its applications in eddy current testing. Appl. Phys. Lett. 118, 012403 (2021).

64.   Ling Lu, Xiaomin Li, Younan Hua and Y. Wu, Magnetic stray field mapping of stainless steel sheets using spin Hall magnetoresistance sensor. AIP Advances 11, 125225 (2021).

65.   Binghai Liu, Andrew Tan, Younan Hua, Mingshen Qiao, Xiaomin Li, Characterization and Failure Analysis of OLED devices by FIB/TEM Techniques. International Conference on Display Technology ( ICDT2021 ) , Fuzhou, China, 25 April, (2021)

2021 （15 Papers）

66.   Younan Hua and Li Xiaomin，Lois Liao, Yuanyuan Liu , Zhang Linhua. Studies and Applications of a New Delineation Method of Silicon Defects in Wafer Fabrication. The Proceedings of the 48th International Symposium for Testing and Failure Analysis (ISTFA 2022), November 1-5, 2022, Portland, Ore. USA (2022).

67.   Lois Liao, Xi Zhang, Younan Hua, Li Xiaomin. Chlorine and sulfur effects on gold wire bond reliability. The Proceedings of the 48th International Symposium for Testing and Failure Analysis (ISTFA 2022), November 1-5, 2022, Portland, Ore. USA (2022).

68.   Younan Hua, Jinzhi Lois Liao, Binhai Liu, Lei Zhu and Xiaomin Li. Studies of Passivation (Si3N4/SiO2) Qualification Method in Wafer Fabrication. The Proceedings of the 29th International Physics and Failure Analysis (IPFA2022), 18 July, Singapore (2022).

69.   Jinzhi Lois Liao, Bisheng Wang, Xi Zhang, Younan Hua, Xiaomin Li. Chlorine effect on copper bonding wire reliability. The Proceedings of the 29th International Physics and Failure Analysis (IPFA2022), 18 July, Singapore (2022).

70.   Allen Gu, Masako Terada, Heiko Stegmann, Thomas Rodgers, Chao Fu, Yanjing Yang. From System to Package to Interconnect: An Artificial Intelligence Powered 3D X-ray Imaging Solution for Semiconductor Package Structural Analysis and Correlative Microscopic Failure Analysis. The Proceedings of the 29th International Physics and Failure Analysis (IPFA2022), 18 July, Singapore (2022).

71.   Younan Hua, Lois Liao, Yanfei  Zhao, Linhua Zhang, Tingting He, Yuanyuan Liu , Xi Zhang, Chao Fu and Xiaomin Li. Studies and Applications of Al Bondpad Qualification and Monitoring Methodologies in Wafer Fabrication and Advanced Packaging. The proceedings of the 23rd International Conference on Electronic Packaging Technology (ICEPT 2022), Paper No. 471, 10-13, Aug 2022, Dalian, China (2022).

72.   Jinzhi Lois Liao, Bisheng Wang, Xi Zhang, Younan Hua and Xiaomin Li, Reliability study of Au-Al wire bond under Cl environment. The proceedings of the 23rd International Conference on Electronic Packaging Technology (ICEPT 2022), Paper No. 27, 10-13, Aug 2022, Dalian, China (2022).

73.   Linhua Zhang, Younan Hua and Xiaomin Li, Studies and Application of Failure Analysis Technology for Semiconductor Advanced Processes. The proceedings of the 23rd International Conference on Electronic Packaging Technology (ICEPT 2022), Paper No. 472, 10-13, Aug 2022, Dalian, China (2022).

74.   Huan Xu, Lei Zhu, Younan Hua, Xiaomin Li and Jiahui Liu, Quantification of Doping Boron Ions in Si Embedded in Heavily Charging SiN/SiO2 Multiple-Layer Films by Dynamic SIMS. The proceedings of the 23rd International Conference on Electronic Packaging Technology (ICEPT 2022), Paper No. 490, 10-13, Aug 2022, Dalian, China (2022)

75.   Liao Jinzhi Lois, Tian Meng, Du Yong, Ji Qiang, Zhu Lei, Zhang Xi, Hua Younan, Li Xiaomin. Application of deuterium oxide (D2O) isotope tracing technique for encapsulated QFN failure analysis. Microelectronics Reliability, ISSN: 0026-2714, 135，114607 (2022).

76.   Jinzhi Liao， Haifeng Zhao, Shengxiang Wang, Junrong Wang, Xi Zhang,Younan Hua， Xiaomin Li. Heavy water tracing method detects the water vapor intrusion path of LCD, Chinese Journal of Liquid Crystals and Displays (2022)

77.   Hua Younan, Liu Binghai, Liao Jinzhi Lois, Hsieh Chialum, Zhang Xi and Li Xiaomin. Studies of Electron Backscattered Diffraction (EBSD) Analysis Technique and Its Applications in Wafer Fabrication and Advanced Packaging. The 24th Electronics Packaging Technology Conference (EPTC 2022) , Singapore, 2022.

78.   Lois Jinzhi  Liao, Wang Bisheng, Zhang Xi, Hua Younan and Li Xiaomin. Study of moisture penetration in epoxy encapsulant by deuterium oxide (D2O) isotope tracing technique. The 24th Electronics Packaging Technology Conference (EPTC 2022) , Singapore, 2022.

79.   Liao Jinzhi Lois, Wang Bisheng, Zhang Xi, Hua Younan, Li Xiaomin. Chlorine and sulfur effects on copper wire bond reliability. The Proceedings of the 24th Electronics Packaging Technology Conference (EPTC 2022), Dec 7-9, 2022, Singapore (2022).

80.   Zhu Lei, and Li Xiaomin. “Surface Analysis Work Flow For NSOP Failure Cases” The proceedings of the 23rd International Conference on Electronic Packaging Technology (ICEPT 2022), Conference Invited Talk, 10-13, Aug 2022, Dalian, China (2022).

Books

81.   Rakesh G. Mote and Li Xiaomin, Focused Ion Beam (FIB) Nanofinishing for Ultra-Thin TEM Sample Preparation. Section III Advanced Nanofinishing Processes, Nanofinishing Science and Technology, Basic and Advanced Finishing and Polishing Processes edited by V. K. JAIN, CRC Press, 15 Aug 2016, p155-178 (2016)

82.   Binghai Liu, Zhi Li Dong, Younan Hua, Chao Fu, Xiaomin Li, Pik Kee Tan, and Yuzhe Zhao Electron-beam radiation induced degradation of silicon nitride and its impact to semiconductor failure analysis by TEM, AIP Advances vol. 8, 115327 (2018).

Company Logo

83.   Wintech Nano Logo, Filed Trade Mark No. 40202117826R, Registrar of Trade Marks Singapore, 28 July 2021 (2021)