輔助研發合作
- 分類：首頁近期亮點
- 發布時間：2022-05-18 14:01:49
- 訪問量：0
概要:作為獨立第三方分析和輔助研發機構，勝科納米擁有高端實驗室分析與研發能力。公司專注從事半導體材料分析、破壞性物理分析、失效分析、可靠性分析和輔助研發等服務，是國內半導體分析測試細分領域里的龍頭企業和“隱形冠軍”，也被業界譽為半導體芯片“全科醫院”。
詳情
作為獨立第三方分析和輔助研發機構，勝科納米擁有高端實驗室分析與研發能力，并與世界知名企業長期開展合作，積極參與多個半導體先進制程的研發項目。技術研發團隊承接客戶需求，對項目案件背景進行消化理解，將最終結論性報告直接反饋至客戶公司研發部、工程部直接對接及設計方案，有效協助設備或產品的輔助研發工作，形成多項半導體產業發展的全球化產業鏈分工合作的經典案例，充分驗證Labless新一代商業模式的可行性與無可比擬的巨大市場潛力。
勝科納米通過近20年來的分析測試研究，建立超過600萬大型數據庫，擁有世界領先的獨創分析技術近百余項，在半導體晶片制造、集成電路芯片封裝、汽車電子新材料、新能源、化學化工、地質與礦物等領域積累了全產業鏈的綜合分析能力。未來，勝科納米將持續加強與半導體產業鏈的深度合作，切實保障客戶利益，確保信息安全，并期待與更多合作伙伴攜手共進，助力產業良性發展。
勝科納米與世界知名企業合作
聯合發表的論文（Publications）
2018年
1.Wang Bisheng, Lois Liao Jinzhi and Li Xiaomin. Characterization of interfacial intermetallic compounds in gold wire bonding with copper pad. IEEE 20th Electronics Packaging Technology Conference, Singapore, p1-5 (2018).
2.Lois Liao Jinzhi; Chen Yan; Wang Bisheng; Li Xiaomin; Fu Chao; Hua Younan, A Review on the Copper Bond Pad Application in Wire Bond Technique,, The 19th International Conference on Electronic Packaging Technology (ICEPT), 2018 IEEE , 08-11 Aug, Shanghai, China (2018).
2019年
1.Wang Bisheng, Lois Liao Jinzhi, Zhang Xi, Li Xiaomin, Hua Younan, Tee Weikok, Yee Boonhwa and Mao Songlin, Comparison of Cl effect on Au-Al and Cu-Al HTS and bHAST wire bond reliability performance. The Proceedings of the 26th International Physics and Failure Analysis (IPFA2019) = No. 156; July 2019, Hangzhou, China (2019).
2.Lois Liao Jinzhi, Zhang Xi, Wang Bisheng, Li Xiaomin, Hua Younan, Fu Chao, Tee Weikok, Yee Boonhwa and Mao Songlin, Comprehensive study of wire bond reliability impacts from wire, molding compound and bond pad contaminations. The Proceedings of the ICICDT conference; 17-19 June 2019, Suzhou, China (2019).
2020年
1.Liao Jinzhi Lois1, Yu Minglang, Tee Weikok, Wang Bisheng, Jia Wenping, Yee Boonhwa, Zheng Haipeng, Zhang Xi, Fu Chao, Hua Younan and Li Xiaomin, COMPREHENSIVE COMPARISON OF THE WIRE BOND RELIABILITY PERFORMANCE OF CU, PDCU AND AG WIRES, CSTIC2020 Shanghai, China 18-20 March (2020).
2.Din-Ghee Neoh, Tee Weikok, Liao Jinzhi Lois, Jia Wenping, Yee Boonhwa, Boon-Seong LEE, Wang Bisheng, Zhang Xi, Hua Younan and Li Xiaomin, ENHANCING HIGH TEMPERATURE ADHESION PERFORMANCE VIA A RENOVATED LEADFRAME SURFACE TREATMENT, CSTIC2020, Shanghai, China 18-20 March (2020).
3.Liao Jinzhi Lois, Tee Weikok, Yu Minglang, Wang Bisheng, Zhang Xi, Yee Boonhwa, Hua Younan and Li Xiaomin, bHAST, PCT, TCT reliability performance comparison of Cu-Al, PdCu-Al, Ag-Al, EPTC (2020), Singapore (2020).
2021年
1.Lois Jinzhi Liao, Wang Bisheng, Zhang Xi, Hua Younan and Li Xiaomin. Study of moisture penetration in epoxy encapsulant by deuterium oxide (D2O) isotope tracing technique. The 24th Electronics Packaging Technology Conference (EPTC 2022) , Singapore, 2022.
2.Liao Jinzhi Lois, Wang Bisheng, Zhang Xi, Hua Younan, Li Xiaomin. Chlorine and sulfur effects on copper wire bond reliability. The Proceedings of the 24th Electronics Packaging Technology Conference (EPTC 2022), Dec 7-9, 2022, Singapore (2022).
掃二維碼用手機看
0512-62800006
sales-cn@wintech-nano.com
